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Our Custom Hybrid Assembly Services Keep Your Business Moving


Offering a broad range of services and solutions

Rochester Electronics can support your hybrid module assemblies per MIL-PRF-38534 and MIL-STD-883, offering a diverse range of substrates and assembly techniques.

 

Our Newburyport, MA, facilities feature over 60,000 square feet of cleanroom space, providing hermetic assembly services. We are registered to manufacture ITAR products.

 

Rochester has the following certifications:

 

  • US DLA (Defense Logistics Agency) certification for in-house assembly, electrical test screening, burn in, reliability testing, and QCI Groups A, B, C, and D

 


We provide a broad range of qualified hermetic packages and can support many custom offerings. To support the product assembly process, we offer wafer processing services, such as backgrind and dicing, and package finishing services, including tin lead (SnPb) finishing and dipping. Additionally, our reliability labs conduct essential stress tests to ensure that all hybrid products can withstand even the most demanding environments.

 

Hybrid Assembly Services Include:

 

  • Wafer backgrind
  • Wafer dicing
  • Substrate (thick and thin film alumina, quartz/fused silica, aluminum nitride, sapphire, and other options available)
  • Substrate installation (eutectic solder and epoxy attach methodology)
  • Fully automated epoxy dispensing (dual head)
  • Die Attach (Au/Si Eutectic and epoxy attach)
  • Passive and active components
  • Multiple components in a single pass
  • Automated optical inspection (AOI)
  • Convection cure with profile capability
  • Automated wire bonding (gold ball, gold wedge, and aluminum wedge techniques)
  • Sealing (automated seam sealing, seam seal, and solder seal of both metal and ceramic packages)
  • Vacuum bake
  • Laser trim (active and passive trim)
  • Laser marking
  • Environmental stress screening per MIL-STD-883
  • Full test capability
  • Qualification per MIL-STD-883
  • Analytical services: Construction analysis, failure analysis, electrical fault isolation