Wafer Processing and Storage
Rochester Electronics offers a range of services at our Newburyport facility to extend semiconductor product lifecycles with wafer storage and die processing services.
Wafer Processing
- Wafer back-side grind
- Wafer dicing
- Die pick and place
- Die inspection
Die Banking
Long-Term Storage
- Long-term storage and managed logistics manufacturing programs
- Lot acceptance and reliability test services to ensure full product functionality
- Parts management
- Usage reporting
- Associated documents are converted and stored electronically.
- ERP control of wafer inventory and attributes
- Electronic Wafer map generation for inked wafers
Next-Generation Storage
- ISO-7/10K certified
- Enhanced ESD controls
- ISO-5 Inspection areas
- Relative humidity control
- Real-time monitoring of temperature and humidity
- Auto-purge on power fail
- Secure room and individual cabinets
Wafer Processing
Articles
Rochester Electronics Semiconductor Die Processing Services Enables Quicker Time to Market
Providing wafer storage and die processing solutions to keep production moving.
Comprehensive Reliable Wafer Storage and Die Processing
Rochester Electronics' wafer processing and storage capabilities.
Case Study
Rochester Electronics Semiconductor Die Processing Services Enables Quicker Time to Market
Rochester helped a valued long-term partner enhance their production capacity and achieve faster time-to-market through our flexible, yet highly secure die processing and wafer storage services.
White Papers
Long-term storage represents a viable solution to maintaining a continuous supply of semiconductor components in long-lifecycle applications but how does long-term storage affect performance? Rochester tested components, spanning a variety of package styles, stored for periods of up to 17 years.
The Effects of Long-Term Storage on Solderability of Semiconductor Components
For items that have been in long-term storage, quality and reliability are key concerns. To determine the quality of aged components in real-world applications, Rochester performed an analysis of solderability by using an industry-standard board mount with solder paste and reflow manufacturing process.
Compatibility of Traditional Solderability Testing for Aged Semiconductor Components
Despite increasing industry acknowledgment that date code restrictions lack an empirical basis, some users of semiconductor components and contract manufacturers still enforce limitations on older products. This study builds on previous research and evaluates SMT components' solderability and board assembly performance after long-term storage.
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