Assembly
Rochester Electronics offers a wide range of in-house capabilities providing quick-turn delivery.
Hermetic Assembly
- Automated and semi-automated assembly equipment
- Eutectic, Silver Glass and Epoxy Die Attach
- Frit, Solder Seal and Metal Can Sealing
- Package replications including leadframes
- DLA certified
- Flexible equipment to handle mix of package types
- Commercial and Military flows
- In-house reliability testing
- Qualification services available
Learn more about our Hermetic Portfolio of Standard Products
Learn more about our Hybrid Assembly Solutions
Quick Turn Package Assembly Services
We offer a broad range of package styles for quick turn IC prototyping, enabling a faster time-to-market for new product introductions.
Learn more about our Quick Turn Package Assembly Services
Plastic Assembly
- Automated saw, die attach and wire bond equipment
- Full automold and semi-automated mold equipment
- Flexible manufacturing space supporting a range of volumes
- Leadframe options including: design/replication, pre-plated, spot plated
- Gold ball bond
- Epoxy die attach
- Custom assembly solutions
- Qualification services available
View Our Plastic Assembly Line Card
Component Lead Finishing
- SnPb, Matte Sn, and Ni Plating
- Flexible rack plating system supports plating of leadframes and other electronic components
- Configurable for other plating solutions
- Pre-plated RoHs frames
- Solder dip options
Package, Substrate and Leadframe Replication
- Ability to re-introduce most package technologies
- ROHS/SnPb lead finishes available
- JEDEC and custom package outlines
- Substrate and leadframe design services available
- Qualification services available
Plastic Assembly
Component Lead Finishing
Hybrid Assembly Services
Articles
Ensuring long-term component support for existing SOIC footprints and small pin count PLCCs.
Mitigating Supply Chain Obsolescence: Ball Grid Array Packaging for High Pin Count Products
Ensuring long-term component support with onshore BGA assembly.
Rochester Electronics is the QFN Solution
Ensuring long-term component support for existing SOIC footprints and small pin count PLCCs.
Case Studies
Preventing a Line-Down Crisis from End-of-Life Semiconductor Components
Rochester Electronics assembled a Plastic Leaded Chip Carrier (PLCC) package for an Industrial OEM manufacturer facing a line-down crisis, through our partnership with the original component manufacturer.
Rochester Electronics Qualifies Hermetic Packages for MC68040FE Microcontrollers
A valued Rochester customer required an ongoing supply of the MC68040FE processor to produce medical ventilators to be used in the fight against COVID-19.
Providing a Continuous Source of Supply for Critical Processors
Rochester Electronics worked with an OCM supplier partner to provide an assembly solution for their 240 lead CQFP hermetic package, which was no longer available in the market.
Extending the Product Lifecycle of End-of-Life Components
Rochester, in partnership with a leading original component manufacturer, provided assembly, test, and reliability services to extend the life of an in-demand high-speed Clock Generator.
Flyers
Rochester Solutions Quick Turn Package Assembly Services
Rochester Electronics now provides a broad range of package styles for IC prototyping, enabling quicker time-to-market for new product introductions.
Hybrid Module Assembly Services
Rochester Electronics can support your Hybrid Module assemblies per MIL-PRF-38534 and MIL-STD-883 with a range of substrates and assembly techniques.
Explore Services
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