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Rochester Secures Support for EOL 300mil and 400mil SOJ Packaged SRAMs


Partnering with ISSI to extend availability

Over the past two decades, the SRAM memory market has seen dramatic changes; technological advancement allowed many discrete SRAM benefits to be cost-effectively replaced by integrated memory. Suppliers such as Cypress, GSI, Renesas, and Samsung have been compelled to consolidate their portfolios and, in some cases, have exited the business. Integrated Silicon Solutions’ (ISSI) is an exception to this trend and continues to support these devices.


Unfortunately, continuing a product line is more than solely a matter of wafer and die supply. For legacy products, support of the package often becomes the main challenge. Such is the case for ISSI’s 300M and 400M SOJ SRAM packages. A last-time-buy notice has been implemented, and ISSI has stopped taking orders as of June 30, 2024.

To provide additional support beyond the last-time-ship date, Rochester Electronics has partnered with ISSI to complete a strategic purchase of these devices. Rochester’s inventory now covers 300mil and 400mil SOJ package options, a mix of densities, multiple speed grades, and 3.3V or 5V supply options.


Rochester Electronics also has the capability to acquire additional wafer. If demand continues beyond existing inventory, a Rochester-manufactured solution can be considered.

Rochester Electronics - ISSI SRAMs