Rochester Is the Long-term Source for NXP’s MPC860 & MPC855 Processors
Keeping critical end-of-life devices alive with qualified BGA package
Often, a year or two after a supplier issues a product discontinuation notice and last-time-buy date, a segment of the customer base realizes they underestimated their needs or missed the notification altogether.
Customers of NXP Semiconductors’ MPC860/MPC855 PowerQUICC™ microprocessors need not worry. Rochester Electronics and NXP have partnered to continue production beyond the original published last-ship date of December 1, 2023. Through an exclusive NXP factory end-of-life (EOL) die purchase, along with assembly and test licensing, Rochester is continuing production of this product line. These devices are built from NXP-originated die using licensed assembly and test program specifications to provide a drop-in replacement that requires no design modifications.
To further ensure long-term production, Rochester is developing in-house capabilities on the 357-pin ball grid array (BGA) package used throughout the product family.
Rochester Electronics has a long-standing partnership with NXP — providing 100% authorized, traceable, certified, and guaranteed solutions.
Our full NXP product portfolio includes a broad range of microprocessors, microcontrollers, sensors, analogs, mixed signals, RF power, and standard products.
CONTACT US to learn more about our extended lifecycle support.
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