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Moving Beyond the BOM: Rochester Electronics’ Design, Product Replication, and System Analysis


Design and Product Replication Solutions

Rochester Electronics continues to invest in solutions to extend the life of semiconductor products to best support our customers. These investments include expansion of office space to better accommodate for our growing Design team and lab capabilities. The Rochester Design team has over 400 combined years of career experience spanning across all aspects of custom silicon Design and Development. Rochester specializes in the authorized porting of products from original fab processes. Our additional capabilities include:


  • DO-254 minor change classification
  • Rochester has completed several DAL-A projects
  • DO-178 compliance with 100% Software compatibility and no errata
  • Unique proof-of-duplication methodology
  • Electrical performance replication, including output edge-rate matching
  • Highly capable detailed signal integrity analysis
  • Legacy voltage ASIC designs for legacy FPGA replacement, supporting 3v and 5v
  • Leveraging fully owned LSI Logic ASIC technologies
  • ASIC designs for long-life systems
  • Creative board-level solutions enabling the continuation of long-life systems
  • Whole product analysis for long-term risk and support (Beyond the BOM)


Within Rochester’s Burnsville, MN, and Rockville, MD offices reside our labs that enable electrical device characterization of original devices, as well as our silicon replacement devices across temperature and voltage limits. For ported products, this results in matching IO performance, including edge-rates that ensure no new harmonics are introduced. Below is a customer-generated sample of edge-rate matching enabled by our lab analysis. Notice the precise edge alignment of this ported product ensures no new signal integrity concerns.

Rochester Electronics - Beyond the BOM

"Beyond the BOM” is a recent service where our Design Group performs a system BOM analysis looking for the following:


  • Architecture and product choices, even within a product line from an OCM
  • BOM alignment with OCM product longevity programs
  • Protocol adoption and standards adoption, which enables alternative products
  • Board layout methodology when using commodity products that are known to change rapidly
  • Recommended package selection
  • Recommended key product process fab selection compared to heartbeat products
  • Security and thoroughness of the product archive through to RTL, Constraints, and IP selection of the FPGA’s and ASIC products.


From new silicon implementations to board designs mitigating obsolescence, to our newly added “Beyond the BOM” service, the expertise and experience of The Design Team at Rochester Electronics is here to help you avoid costly extensive requalification. We work with our customers to deliver solutions that keep long-life systems moving.


Watch to learn more about our Design and Authorized Product Replication Solutions


Learn more about the products that Rochester has replicated


White paper: Avoiding DO-254 Events: Major/Minor Change Classification


Do you have questions for our Design Team? Contact us today



Rochester Electronics - Output Pin Rising