Extending the Life of Customer-Provided BGA Components with In-House Reballing Services
Replacement and conversion for lifecycle solutions
What do you do when a BGA-assembled semiconductor part shifts from a leaded to RoHS-compliant version or when long-stored BGA components show signs of wear or fail inspection during manufacturing?
These challenges can slow down production, increase costs, or even force a redesign.
To help businesses overcome these issues, Rochester Electronics now offers in-house BGA reballing services for customer-provided products.
Reballing involves removing and replacing worn, damaged, or incompatible solder balls on BGA components, either with the same type or a different composition, depending on customer needs. This process enables customers to continue using their existing parts, which match the original in form, fit, and function, without the time and expense of a full redesign.
Our reballing service allows customers to:
- Extend the useful life of inventory.
- Quickly adapt to leaded or lead-free requirements.
- Improve product yield and solderability.
- Reduce risk and delays in production.
We adhere to globally recognized standards (IEC TS62647-4) to ensure high quality, reliability, and consistency. Every step, from thermal control and cleaning to detailed inspections and solder testing, is carefully managed so that parts are fully ready for final assembly.
For over 40 years, Rochester has partnered with more than 70 leading semiconductor manufacturers to provide customers with a reliable source of critical semiconductors through authorized distribution, design and replication services, and licensed manufacturing. As an original manufacturer stocking distributor, Rochester has over 15 billion devices in stock, encompassing 200,000 part numbers, providing the world’s most extensive range of end-of-life (EOL) and the broadest range of active semiconductors. Rochester has produced over 20,000 device types and, with more than 12 billion die in stock, we’re capable of manufacturing over 70,000 device types.
Learn more about all of Rochester's Lifecycle Solution capabilities and services.
Contact us with your requirements
WATCH: To learn more about Rochester's Plastic Assembly Capabilites
Learn more about Rochester's Assembly Services
Mitigating Supply Chain Obsolescence: Ball Grid Array Packaging for High Pin Count Products
Manufacturers
