Our in-house equipment includes thermal, mechanical, moisture, and bond testing.

Rochester Electronics has significant expertise in stress-testing which enables our customers to accelerate potential failure mechanisms, help identify the root cause, and take actions to prevent failure mode.

  • MIL-STD-883 TM 5004 and 5005 for Levels B, Q, and V
  • QML Certification to MIL-PR-38535 cage code (3V146)
  • In-House DLA lab certified for Group A, B, C and D
  • Reliability testing to JEDEC standards
Rochester’s Commitment to Quality

Capabilities

Group A

  • Electrical inspection testing

Group C

  • Life

Group B

  • Resistance to solvents/mark permanency
  • Solderability
  • Bond pull (Destruct and Non-Destruct)
  • Bond shear, die shear, ball shear

Group D

  • Physical dimensions
  • Bending stress and lead Integrity
  • Mechanical and thermal shock
  • Temperature cycle
  • Moisture resistance
  • Variable frequency vibration
  • Constant acceleration
  • Fine leak/gross leak Cond A C
  • Salt atmosphere
  • Adhesion of lead finish
  • Lid torque
  • External visual

JEDEC

  • Preconditioning
  • Temp Cycle
  • HAST/UHAST
  • HTSL

Solderability

  • Wetting balance
  • Dip and look
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