Our in-house equipment includes thermal, mechanical, moisture, and bond testing.
Rochester Electronics has significant expertise in stress-testing which enables our customers to accelerate potential failure mechanisms, help identify the root cause, and take actions to prevent failure mode.
- MIL-STD-883 TM 5004 and 5005 for Levels B, Q, and V
- QML Certification to MIL-PR-38535 cage code (3V146)
- In-House DLA lab certified for Group A, B, C and D
- Reliability testing to JEDEC standards
Capabilities
Group A
- Electrical inspection testing
Group C
- Life
Group B
- Resistance to solvents/mark permanency
- Solderability
- Bond pull (Destruct and Non-Destruct)
- Bond shear, die shear, ball shear
Group D
- Physical dimensions
- Bending stress and lead Integrity
- Mechanical and thermal shock
- Temperature cycle
- Moisture resistance
- Variable frequency vibration
- Constant acceleration
- Fine leak/gross leak Cond A C
- Salt atmosphere
- Adhesion of lead finish
- Lid torque
- External visual
JEDEC
- Preconditioning
- Temp Cycle
- HAST/UHAST
- HTSL
Solderability
- Wetting balance
- Dip and look