In-house solutions to keep your business moving.
Hermetic Assembly
- Automated and semi-automated assembly equipment
- Eutectic, Silver Glass and Epoxy Die Attach
- Frit, Solder Seal and Metal Can Sealing
- Package replications including leadframes
- DLA certified
- Flexible equipment to handle mix of package types
- Commercial and Military flows
- In-house reliability testing
- Qualification services available
Learn more about our Hermetic Portfolio of Standard Products
Plastic Assembly
- Automated saw, die attach and wire bond equipment
- Full automold and semi-automated mold equipment
- Flexible manufacturing space supporting a range of volumes
- Leadframe options including: design/replication, pre-plated, spot plated
- Gold ball bond
- Epoxy die attach
- Custom assembly solutions
- Qualification services available
Open Cavity Packaging (OCPs)
We offer a broad range of Open Cavity Packages (OCPs) for quick-turn IC prototyping, enabling a quicker time-to-market for new product introductions.
Component Lead Finishing
- SnPb, Matte Sn, and Ni Plating
- Flexible rack plating system supports plating of leadframes and other
electronic components - Configurable for other plating solutions
- Pre-plated RoHs frames
- Solder dip options
Package, Substrate and Leadframe Replication
- Ability to re-introduce most package technologies
- ROHS/SnPb lead finishes available
- JEDEC and custom package outlines
- Substrate and leadframe design services available
- Qualification services available
Manufacturing Services Brochure