In an effort to provide complete long-term support solutions to all of our customers, we offer the following value-added services:
Design Directory Service
Rochester is pleased to now offer a semiconductor design archive recovery service. If you have archives on obsolete media, we have the capability to restore and read many old media formats and translate the design archive files into a usable data set.
We support a variety of tape, floppy diskette, and optical formats as well as variety of operating systems, backup formats, and drawing formats. Our staff are experienced data recovery specialists with knowledge of semiconductor design archive formats such as GDS and Applicon.
Contact us today to request a quote to recover your design archive from media.
Tape and Reel Services:
Rochester provides a variety of Tape and Reel options, governed by the size and configuration of your component. We offer tape and reel service for surface mount, axial and radial package styles, as well as the option for either Heat Seal Cover Tape or PSA (Pressure Sensitive Adhesive) Cover Tape.
The utilization of state-of-the-art equipment assures our customers the highest quality results with minimal component handling. This packaging process meets the requirements of EIA-481 Standard.
The materials used in the process are static dissipative for ESD protection. Please contact your local Rochester Electronics sales representative for additional information on pricing and lead-time.
Rochester Electronics has DLA lab suitability to perform solderability testing to the requirements of MIL-STD-883 Test Method 2003 and EIA J-STD-002.
Solderability evaluations are made to verify that the solderability of component leads and terminations meets the requirements established in this standard and to determine that proper storage has had no adverse effect on the ability to solder components to an interconnecting substrate.
Solderability testing provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using SnPb or Pb-free solder. The procedure, considered to be destructive, will test whether the packaging materials and processes used during the manufacturing operations produce a component that can be successfully soldered in the next level assembly after being preconditioned. Please contact your local Rochester Electronics sales representative for information on pricing and lead-time.
Bake and Dry Pack:
All of our moisture sensitive devices are baked and dry packed in accordance with JEDEC J-STD-033B for proper storage.
Components are first baked in our calibrated ovens to insure removal of any moisture and then they are vacuum sealed in a moisture barrier bag with desiccants and HIC card to verify their condition prior to your use. Standard and customer specified labels are used to identify the product lot and date code as well as the quantity.
All of our handling and inspection processes are performed in an ESD safe handling work environment.
A Wide Range of Programmable Products:
Rochester Electronics manufactures and sells a wide range of programmable products including memory, logic devices & microcontrollers.
Although programmable devices can be sold in the unprogrammed state, or “blank-state”, our full service test and programming laboratory can provide value-added programming services for all major semiconductor manufacturers and package styles.
Our highly experienced engineering and technical teams work with the major suppliers of commercially available programming equipment (Data I/O, BP) and OEM specific device programmers, along with automated handling equipment to provide high quality cost effective solutions for our customers. Customers can provide programs using electronic data file transfers, supplied disks or “master” units and all programs are maintained, controlled and archived on our secure server.
Our expert engineering staff can also provide full testing services for most programmable devices after the units are programmed with the user’s specific program. This unique test capability can reduce residual defect rates by providing fault-graded functional, AC, and DC testing of the customers unique design.
Rochester’s commitment and investment in equipment, people and infrastructure combined with over 25 years of experience with programmable semiconductors, provide our customers the competitive edge they demand.
Older Date Code electrical re-testing:
Rochester’s “Engineering-Driven Test Protocol” assures technical leadership in semiconductor testing.
Rochester Electronics test facility is a full service, state-of-the-art test laboratory specializing in high quality semiconductor test and characterization. Rochester provides full testing services using original OEM approved test software and test programs generated by our experienced engineering team. Rochester’s state-of-the-art test facility contains 15 major ATE platforms models and includes over 30 testers. Our expert team of engineers, with over 250 total years of total experience, generate over 100 test programs every year for all major device types including Digital, Analog, RF, Memory, ECL, Mixed Signal, Microprocessor/Microcontrollers, Gate Arrays and ASIC’s