Rochester Electronics provides a broad range of package styles for IC prototyping, enabling quicker time-to-market for new product introductions.

Our Newburyport, MA, facilities have over 160,000 square feet of cleanroom space available to support both plastic and hermetic assembly services.

IC prototyping services are ideal for R&D or pre-production environments and represent a cost-effective solution for low-volume prototypes. Typical applications include RF/Microwave, MEMs, Sensors, and Power electronics.

Rapid Prototype Capabilities Include:

• Wide variety of standard package types including QFNs (3x3 mm to 8x8 mm) and an extensive range of custom solutions.

• Encapsulation services with a wide variety of package lids

• Reliability Testing to JEDEC Standards

Assembly Services Include:

• Wafer Back-grind (up to 300mm silicon wafers)

• Wafer Dicing (up to 300mm silicon wafers)

• Die Attach

• Wire Bonding

• Laser Marking