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Jul 21, 2015 — The famous DIP (Dual In-Line) package is quickly making a final bow as an active device packaging solution for semiconductors. Over the next 2 years, the biggest semiconductor companies in the world are saying goodbye to this packaging solution and some already [...]
Jul 14, 2015 — Intellectual Property or IP is one of the cornerstones of the semiconductor industry. It is a precious commodity that can determine a company’s ability to amass and retain market share in a specific domain. Companies go to great lengths to [...]
Jul 8, 2015 — I am a junior at Endicott College majoring in Business with a concentration in Marketing. Rochester Electronics was of great interest to me due to its competitive history, ingenuity and expectations for excellence. I am eager to learn from high [...]
Jun 17, 2015 — Efficiency and flexibility are the keys when your assembly business model calls for multiple product types, and multiple part numbers within products at volumes that does not warrant a dedicated assembly line. Below are some considerations for the die attach [...]
Jun 11, 2015 — Over the past several years we have seen the major FPGA vendors move away from the support of 5V and 3.3V Field Programmable Gate Array (FPGA) Technologies. This has left many designers faced with common questions and challenges as they [...]