Manufacturing

Wafer Fabrication

Wafer Fabrication

As a fully-authorized source for over 60 Original Semiconductor manufacturers (OCMs), Rochester Electronics has access to wafer/die and intellectual property from the original manufacturer. As a result, Rochester has a 30-year history of storing wafer and die to industry standards. Rochester preserves the wafer/die to assure proper functionality at time of use, and for many years beyond the manufacturing period. In the past 30 years, Rochester has established the world's largest die bank, being the home to billions of die, and as part of extensive expansion plans; Rochester will soon be building a second storage facility to accommodate more wafer/die storage. As the home to the world's largest die bank, Rochester has the ability to manufacturer more than 300,000 devices to the original manufacturer's specifications.

In addition to wafer/die storage, Rochester also supports COTS+ requests which allows for in-stock commercial devices to be screened to a higher temperature range to accommodate a more robust application. Additional services include authorized die sales, back grind, LAT/Element evaluation, and bonded secure storage.

Rochester Electronics is committed to providing customers with the semiconductors they need. The extensive die bank also allows Rochester to work with customers to help find that compatible alternative for a required component in the circumstance that the original requirement was unavailable. Rochester is, and will always be, committed to our customers as long as their critical semiconductor needs exist.