Our expanded, in-house assembly capability offers much faster lead times for our customers as well as additional safety and security. Because all assembly, test, and analysis happen at our in-house facilities, there are no subcontractor-related delays in prototyping. Also, safety and security are guaranteed because the job never leaves our campus. Depending upon the project, what used to take several months is often done in a few weeks.
Along with standard industry packages, we also have authorization to use the custom package designs of original manufacturers, enabling us to support customers with products that are virtually identical to the original versions. Packages include CDIP, CERPACK, CPGA, CQFP, CLCC, SB DIP, Flat Pack, PDIP, QFP, SOP, PLCC, METAL CAN, BGA, and SOJ. Others can be added as needed.
Rochester Electronics processes and tests devices according to a number of process flows, each specific to particular products. Process flows include commercial, industrial, military temperature, Rochester R, Rochester B, MIL-STD-883, SMD/QML, and space-level S/V.