Assembly - Packaging
|
Package authorization
In addition to the standard industry packages, Rochester is granted access to many of the original manufacturer's custom package designs in order to continue support for products they no longer offer. This helps Rochester to support customers with products that are virtually identical to the original versions. Metal window lids In cases where the original packages or lids are no longer available, Rochester can re-manufacture these components in order to provide continuing support. Rochester's redevelopment of the Semi-Alloys metal window lids keeps production going on EPROM and other EPROM embedded products like Intel's 87C family of military products. RoHS Lead Free Packaging At Rochester, commercial-grade devices are assembled using Pb free (lead free) materials and contain no polybrominated biphenyls (PBB), polybrominated diphenyl ether (PBDE), or other prohibited materials deemed hazardous to the environment in accordance with RoHS standards. REI offers lead finishes with either pure tin plating or nickel palladium. Gold plating over palladium is also an available option. When a device is no longer available from the original manufacturer, and a customer turns to Rochester for continued manufacturing, Rochester can manufacture the part to be lead-free/green compliant. What about the devices that have been end-of-lifed prior to the initiative? From Rochester's wafer bank of over 10 billion die, we can continue to manufacture the devices as fully lead-free/green compliant. Depending on customer demand, these may be available in stock or made to order. |