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Before and After Market (BAM) Blog: chip makers respond to mil-spec market pressures

Posted By George Karalias on Feb 25, 2014

Rochester Electronics participates in a guest blog hosted on Military Embedded Systems’ website.  Our latest blog addresses the shift from mil-spec to COTS, which has created difficulty for military contractors.

As mentioned in this blog, “Military equipment requires devices that can withstand extreme temperatures — and other environmental extremes. The old mil temperature range of -55 to 125 degrees Celsius is no longer a design target for the semiconductor companies. Instead, they target industrial markets as their worst-case temperature/voltage requirements if they go beyond commercial.”

To read our full guest blog, please visit the BAM Blog page dedicated to Rochester Electronics.